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HEAT Datasheet, PDF

Searched Keyword : 'HEAT' - Total: 9972 (2/499) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
CUI INC
HSB05-171711 Datasheet pdf image
302Kb/3P
HEAT SINK
HSB14-353518 Datasheet pdf image
396Kb/3P
HEAT SINK
Company Logo Img
TRACO Electronic AG
TEN-HS1 Datasheet pdf image
263Kb/1P
Heat Sink
Rev. November 30, 2022
TEN-HS5 Datasheet pdf image
354Kb/1P
Heat Sink
Rev. November 30, 2022
TEN-HS8 Datasheet pdf image
1Mb/1P
Heat Sink
Rev. November 30, 2022
TEP-HS4 Datasheet pdf image
246Kb/1P
Heat Sink
Rev. November 30, 2022
Company Logo Img
CUI Devices
HSB03-141406 Datasheet pdf image
362Kb/3P
HEAT SINK
08/05/2022
Company Logo Img
CUI INC
HSE-B20X Datasheet pdf image
550Kb/5P
HEAT SINK
HSE-BX-040H Datasheet pdf image
371Kb/4P
HEAT SINK
HSE-BX-045H Datasheet pdf image
467Kb/5P
HEAT SINK
Company Logo Img
Picker Components
PCH Datasheet pdf image
617Kb/3P
Heat Sinks
Company Logo Img
CUI INC
HSB16-404018 Datasheet pdf image
384Kb/3P
HEAT SINK
HSB03-121218 Datasheet pdf image
371Kb/3P
HEAT SINK
HSB11-252518 Datasheet pdf image
402Kb/3P
HEAT SINK
HSB12-272706 Datasheet pdf image
358Kb/3P
HEAT SINK
Company Logo Img
TRACO Electronic AG
TEN-HS3 Datasheet pdf image
328Kb/1P
Heat Sink
Rev. November 30, 2022
TEP-HS1 Datasheet pdf image
201Kb/1P
Heat Sink
Rev. November 30, 2022
TEP-HS5 Datasheet pdf image
153Kb/1P
Heat Sink
Rev. November 30, 2022
THN-HS1 Datasheet pdf image
349Kb/1P
Heat Sink
Rev. November 30, 2022
Company Logo Img
CUI Devices
HSE-BX-01 Datasheet pdf image
460Kb/4P
HEAT SINK
08/05/2022

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What is HEAT


Heat refers to the heat generated by electronic components. Electronic components operate using electricity, and a certain amount of heat is generated during this operation.

This heat affects the performance of electronic components and can cause them to overheat and damage them.

Therefore, thermal management is very important in electronic components.

Various electronic components and solutions for thermal management have been developed, some of which include:

Heat Sink: A device for absorbing and conducting heat, and is mostly made of metal such as aluminum.

Used for parts that generate a lot of heat, such as CPUs and GPUs.

Fan: It is used with a heat sink that absorbs heat and is used to quickly dissipate heat.

Thermal Interface Material: It is used between the heat sink and the parts, and it quickly dissipates heat by improving heat conduction.

Heat Pipe: This is a technology for effectively transferring heat, and is mainly used in portable devices such as laptops.

Liquid Cooling: This is a cooling technology using liquid, which is used in high-performance computers and game consoles.

These thermal management solutions are critical to maintaining the reliability and performance of electronic components.

Thermal management considerations are therefore essential in the design and manufacture of electronic components.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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