MOUNT Datasheet(PDF) - B1X-1 - PowerDynamics, Inc

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MOUNT Datasheet, PDF

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Searched Keyword : 'MOUNT' - Total: 92 (1/5) Pages

Manufacturer	Part #	Datasheet	Description
PowerDynamics, Inc	B1X-1	45Kb/1P	AA (R6) BATTERY HOLDER, PANEL MOUNT
	PD-SP2113-PX3X	356Kb/2P	WATERPROOF MALE FLANGED PANEL MOUNT CONNECTOR
	PD-HEC-MPC	231Kb/1P	HARSH ENVIRONMENT CONNECTOR MALE PANEL MOUNT
	PD-SF1213-S2	206Kb/1P	METAL IP67 WATERPROOF MALE FLANGE MOUNT
	BX-1	44Kb/1P	C SIZE BATTERY HOLDER, PANEL MOUNT
	PD-SF1212-S2	201Kb/1P	METAL IP67 WATERPROOF FEMALE FRONT MOUNT
	PD-SF1213-P2	202Kb/1P	METAL IP67 WATERPROOF MALE FLANGE MOUNT
	PCSP	399Kb/2P	CHASSIS MOUNT EMI/RFI LINE FILTER
	B1X	45Kb/1P	D (R20) BATTERY HOLDER, PANEL MOUNT
	PD-ST1213-S2	205Kb/1P	METAL IP67 WATERPROOF FEMALE REAR PANEL MOUNT
	PD-ST1212-P2	206Kb/1P	METAL IP67 WATERPROOF MALE FRONT PANEL MOUNT
	PD-ST1213-P2	204Kb/1P	METAL IP67 WATERPROOF MALE REAR PANEL MOUNT
	HGN-368	396Kb/2P	IEC 60320 INLET SOCKET WITH SWITCH, FLANGE MOUNT
	PEM	215Kb/6P	CHASSIS MOUNT, MULTI-STAGE EMI/RFI LINE FILTER
	PEMA	427Kb/2P	CHASSIS MOUNT, MULTI-STAGE EMI/RFI APPLIANCE FILTER
	PD-HEC3-FMA	309Kb/1P	PANEL MOUNT ADAPTER FOR HEC3 SERIES PANEL CONNECTORS
	PG01S	226Kb/2P	ECONOMICAL, CHASSIS MOUNT, SINGLE STAGE EMI/RFI LINE FILTER.
	HGN-369	387Kb/2P	IEC 60320 INLET SOCKET WITH VOLTAGE SELECT, FLANGE MOUNT
	PF01PC	213Kb/2P	PC BOARD MOUNT, SINGLE STAGE EMI/RFI LINE FILTER.
	42R51-5124	36Kb/1P	MINIATURE IEC 60320 C8 APPL. INLET; SNAP-IN, PCB MOUNT

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What is MOUNT

In electronic components, Mount refers to the mounting parts to a substrate or PCB (Printed Circuit Board).

When Mounting the parts, use the pins of the part to match the hole of the PCB, or to solder the solder pad on the bottom of the part.

In general, the mount method of electronic components can be divided into two categories:

Through-Hole Mount

Through-Hole Mount is a method of plugging in a hole in a PCB and plugging in parts.

Through-Hole Mount method is only available at a specific location of the PCB, and if the PCB is thick, the parts have the disadvantage of occupying the space from the other side of the PCB.

Surface Mount Technology (SMT)

Surface Mount Technology is a method of Mount parts on the surface of the PCB.

The SMT method can mount parts anywhere on the PCB and takes up less space than the throw-hole mount method, which can reduce the size of the electronic product.

The SMT method is a method of soldering parts to the solder pad, so it is not assumed by the thickness of the PCB, and it can also configure high density circuits.

SMT method is a standard method used in most electronic components recently.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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