SMT stands for Surface Mount Technology, and refers to a technology for attaching electronic components to a circuit board (PCB).
SMT has the advantage of increasing space efficiency and automation process productivity compared to the existing Through-Hole Technology (THT).
SMT attaches electronic components attached to the surface of the PCB through a reflow soldering process.
In this process, electronic components are miniaturized into tiny insulators or packages. In the SMT process, tiny solder pads are first attached to the surface to attach these miniaturized components to the surface of the PCB.
Then, electronic components are attached on top of it, and the entire PCB is heated with a heater to melt and attach the solder.
The SMT process has the advantage of increasing the space efficiency of the PCB by reducing the size of electronic components attached to the PCB.
In addition, productivity can be increased with automated production processes.
Therefore, most of the current electronic components are produced by SMT technology.
*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.
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