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RECOMMENDED Datasheet, PDF

Search Description : 'RECOMMENDED' - Total: 88 (1/5) Pages
Electronic ManufacturerPart NumberDatasheetElectronics Description

HOKURIKU ELECTRIC INDUS...
E011420 Recommended Pad Dimension

Hirose Electric
ZX360D-B-10P RECOMMENDED PANEL CUTOUT PCB LAYOUT FOR REFERENCE

Toshiba Semiconductor
2SA1316 TRANSISTOR (FOR LOW NOISE AUDIO AMPLIFIER, RECOMMENDED FOR THE FIRST STAGES OF MC GEAD AMPLIFIERS)

ABCO ELECTRONICS CO.LTD
LPF2007 Shape & Dimensions / Recommended Solder Land Pattern
LPF2805 Shape & Dimensions / Recommended Solder Land Pattern
LPN1054 Shape & Dimensions / Recommended Solder Land Pattern

Pulse A Technitrol Comp...
SPM2007_47 Tested and recommended by National Semiconductor Base material meets flammability requirements of UL 94V-0

ABCO ELECTRONICS CO.LTD
LPF3513 Shape & Dimensions / Recommended Solder Land Pattern
LPF6027 Shape & Dimensions / Recommended Solder Land Pattern
LPF7044 Shape & Dimensions / Recommended Solder Land Pattern
LPH6012 Shape & Dimensions / Recommended Solder Land Pattern
LPF1245 Shape & Dimensions / Recommended Solder Land Pattern
LPN7850 Shape & Dimensions / Recommended Solder Land Pattern
LPS252010 Shape & Dimensions / Recommended Solder Land Pattern

Micrel Semiconductor
MIC94002 Dual P-Channel MOSFET Not Recommended for New Designs

Panasonic Semiconductor
ELF-21N016A Recommended PWB piercing plan

Texas Instruments
UCC2570DTR Not Recommended for New Design

Toshiba Semiconductor
2SC3381 NPN EPITAXIAL TYPE (LOW NOISE AUDIO AMPLIFIER APPLICATIONS RECOMMENDED FOR CASCODE, CURRENT MIRROR CIRCUIT OF THE FIRST STAGE OF PRE, MAIN AMPLIFIERS)

Micrel Semiconductor
MPD8020 CMOS/DMOS Semicustom High-Voltage Array Summary Information*.Not Recommended for New Designs

ABCO ELECTRONICS CO.LTD
LPN1040_12 Shape & Dimensions / Recommended Solder Land Pattern

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