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HEAT Datasheet, PDF

Searched Keyword : 'HEAT' - Total: 14 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Rohm
SMLK18WB Datasheet pdf image
315Kb/11P
High heat radiation "PSML2" series
SMLK18WBNCW Datasheet pdf image
873Kb/11P
PSML2 series high heat dissipation chip LED
2021.12 - Rev.013
SMLW36 Datasheet pdf image
1Mb/3P
High heat dissipation, high efficiency white LEDs
SMLK34 Datasheet pdf image
1Mb/4P
High heat radiation package from ROHM original flat frame
SMLK19 Datasheet pdf image
1,015Kb/4P
High heat radiation package from ROHM original flat flame structure
SMLK34 Datasheet pdf image
1,018Kb/4P
High heat radiation package from ROHM original flat frame structure
KD3003-RQFW00A Datasheet pdf image
333Kb/2P
For Large-sized, High-speed Label Printers with The Heat historical control
2019.10 - Rev.001
KD2006-RQFW00A Datasheet pdf image
87Kb/2P
For Large-sized, High-speed Label Printers with The Heat historical control
KD3004-RQFW00A Datasheet pdf image
327Kb/2P
For Large-sized, High-speed Label Printers with The Heat historical control
2019.10 - Rev.001
KD3006-RQFW00A Datasheet pdf image
327Kb/2P
For Large-sized, High-speed Label Printers with The Heat historical control
2019.10 - Rev.001
KD2003-RQFW00A Datasheet pdf image
90Kb/2P
For Large-sized, High-speed Label Printers with The Heat historical control
KD3002-RQFW00A Datasheet pdf image
89Kb/2P
For Large-sized, High-speed Label Pr inters wi th The Heat histor ical cont rol
KD2004-RQFW00A Datasheet pdf image
88Kb/2P
For Large-sized, High-speed Label Pr inters wi th The Heat histor ical cont rol
KD2002-RQFW00A Datasheet pdf image
88Kb/2P
For Large-sized, High-speed Label Pr inters wi th The Heat histor ical cont rol

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What is HEAT


Heat refers to the heat generated by electronic components. Electronic components operate using electricity, and a certain amount of heat is generated during this operation.

This heat affects the performance of electronic components and can cause them to overheat and damage them.

Therefore, thermal management is very important in electronic components.

Various electronic components and solutions for thermal management have been developed, some of which include:

Heat Sink: A device for absorbing and conducting heat, and is mostly made of metal such as aluminum.

Used for parts that generate a lot of heat, such as CPUs and GPUs.

Fan: It is used with a heat sink that absorbs heat and is used to quickly dissipate heat.

Thermal Interface Material: It is used between the heat sink and the parts, and it quickly dissipates heat by improving heat conduction.

Heat Pipe: This is a technology for effectively transferring heat, and is mainly used in portable devices such as laptops.

Liquid Cooling: This is a cooling technology using liquid, which is used in high-performance computers and game consoles.

These thermal management solutions are critical to maintaining the reliability and performance of electronic components.

Thermal management considerations are therefore essential in the design and manufacture of electronic components.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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