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HIGH Datasheet, PDF

Anshan Leadsun Electronics Co., Ltd(86)Custom MMIC Design Services, Inc.(7)DENSEI-LAMBDA(4)Dongguan City Niuhang Electronics Co.LTD(3)Guangdong Kexin Industrial Co.,Ltd(125)KEC(Korea Electronics)(270)Kemet Corporation(1434)Kersemi Electronic Co., Ltd.(150)Keysight Technologies(6)Kingbor Technology Co(6)Kingbright Corporation(25)Kingtronics International Company(7)Knowles Electronics(4)Knox Semiconductor, Inc(4)KOA Speer Electronics, Inc.(26)KODENSHI KOREA CORP.(126)KR Electronics, Inc.(1)Kwang Myoung I.S. CO.,LTD(8)Kycon, Inc.(15)Kyocera Kinseki Corpotation(14)Laird Tech Smart Technology(26)Lattice Semiconductor(80)LDT Co., Ltd(2)Leadtrend Technology(13)Ledil, Inc.(171)LEM(3)Leshan Radio Company(202)Level One(12)LIGITEK electronics co., ltd.(34)Linear Dimensions Semiconductor(7)Linear Integrated Systems(19)Linear Technology(870)Linkage Goston Electronics Co., LTD(22)Lite-On Technology Corporation(84)Littelfuse(170)Lucky Light Electronic(1)LUMEX INC.(85)Lumileds Lighting Company(60)Lumins Inc.(2)Luminus, Inc(16)Luna Innovations Incorporated(9)LUXPIA(27)Lyontek Inc.(69)M-pulse Microwave Inc.(9)M.S. Kennedy Corporation(90)M/A-COM Technology Solutions, Inc.(255)Macronix International(14)MagnaChip Semiconductor.(16)Major-Power Technology Co., LTD.(2)Make-Ps(1)MAKO SEMICONDUCTOR CO.,LIMITED(49)Mallory performance club(3)Marktech Corporate(120)Marl International Limited(55)Maxic Technology Corporation(33)Maxim Integrated Products(49)Maxwell Technologies(1)MDE Semiconductor, Inc.(29)Mean Well Enterprises Co., Ltd.(51)Mechatronics, Inc.(1)Meder Electronic(8)Melexis Microelectronic Systems(28)Mercury United Electronics Inc(14)MERITEK ELECTRONICS CORPORATION(19)MIC GROUP RECTIFIERS(26)Micrel Semiconductor(118)Micro Analog systems(1)Micro Commercial Components(217)Micro Electronics(167)Micro Linear Corporation(22)Microchip Technology(67)Micronetics, Inc.(64)Micropac Industries(49)MicroPower Direct, LLC(43)Microsemi Corporation(231)Micross Components(99)Mimix Broadband(23)Mini-Circuits(345)Minilogic Device Corporation Limited(3)Minmax Technology Co., Ltd.(17)Mitel Networks Corporation(5)Mitsubishi Electric Semiconductor(696)Mitsumi Electronics, Corp.(4)Mixed Signal Integration(5)MKS Instruments.(9)MMD Components(4)Molex Electronics Ltd.(155)Molex Electronics Ltd.(21)Molex Electronics Ltd.(61)Molex Electronics Ltd.(799)Molex Electronics Ltd.(38)Molex Electronics Ltd.(117)Molex Electronics Ltd.(35)Molex Electronics Ltd.(229)Molex Electronics Ltd.(396)Molex Electronics Ltd.(459)Molex Electronics Ltd.(88)MolexKits(7)Monolithic Power Systems(232)MORNSUN Science& Technology Ltd.(26)MOSA ELECTRONICS(4)Mosel Vitelic, Corp(93)Mospec Semiconductor(30)MotionKing Motor Industry Co.,Ltd.(3)Motorola, Inc(120)MPS Industries, Inc.(27)MTRONPTI(19)Murata Manufacturing Co., Ltd.(664)Murata Power Solutions Inc.(25)MY-SEMI INC.(5)Naina Semiconductor ltd.(12)Nais(Matsushita Electric Works)(18)Nanjing Ouzhuo Technology Co., Ltd.(7)National Instruments Corporation(2)National Semiconductor (TI)(395)NEC(279)Nel Frequency Controls,inc(13)Nell Semiconductor Co., Ltd(29)Neutrik AG(13)New Japan Radio(72)New Jersey Semi-Conductor Products, Inc.(188)Newhaven Display International, Inc.(3)Nexperia B.V. All rights reserved(16)NIC-Components Corp.(5)Nichicon corporation(26)NIHON DEMPA KOGYO(28)Nihon Inter Electronics Corporation(48)Nihon Kaiheiki Industry Co. Ltd.(5)NIKO SEMICONDUCTOR CO., LTD.(18)Nippon Precision Circuits Inc(6)Nominal Controls Inc.(12)NTE Electronics(306)Nuvoton Technology Corporation(2)NXP Semiconductors(130)OEN India Limited(3)Ohmite Mfg. Co.(58)Okaya Electric America, Inc.(10)OKI electronic componets(14)Olitech Electronics Co.Ltd(4)OmniVision Technologies, Inc.(19)Omron Electronics LLC(53)ON Semiconductor(747)OPLINK Communications Inc.(6)Opnext. Inc.(13)OPTEK Technologies(39)OptoDiode Corp(33)OptoSupply International(67)ORing Industrial Networking Corp(1)ORION FANS(14)Orister Corporation(5)OSA Opto Light GmbH(56)Oscilent Corporation(3)OSRAM GmbH(174)Oxford Semiconductor(8)Shanghai Leiditech Electronic Technology Co., Ltd(10)SHENZHEN KOO CHIN ELECTRONICS CO., LTD.(6)SHENZHEN KYL COMMUNICATION EQUIPMENT CO,LTD.(6)Shenzhen Luguang Electronic Technology Co., Ltd(125)Shenzhen Xinmao Microelectronics Co., Ltd.(23)Tyco Electronics(261)
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Search Description : 'HIGH' - Total: 459 (1/23) Pages
ManufacturerPart NumberDatasheetDescription

Molex Electronics Ltd.
34787-3004
49Kb / 2P
HS Stac™ Right Angle 3 Bay Header Assembly, Bay 1 - High Speed, Polarization D, Bay 2 - High Speed, Polarization A, Bay 3 - High Speed, Polarization E
15-47-7730
35Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature,
39980-0404
41Kb / 2P
8.00mm Pitch Beau Eurostyle Fixed Mount, High Voltage PCB Terminal Block
15-47-7614
35Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature,
39950-0106
39Kb / 2P
8.00mm Pitch Beau Eurostyle Fixed Mount, High Voltage PCB Terminal Block
130110-0050
31Kb / 1P
Pro-Yellow 400W Metal Halide High Bay Light with Lamp Molded 18/3 SJTW 1.83m
0917143014
120Kb / 3P
1.27mm (.050") Pitch Picoflex PF-50 Header, Right Angle, High Temp, Gold (Au) Plating
30700-1148
48Kb / 1P
2.54mm Pitch, 0.64mm Width H-DAC 64 High Density Automotive Connectors
106283-1065
33Kb / 1P
Quad Small Form-factor Pluggable Plus (QSFP) Optical Cable Assembly, 4 TX, 4 RX 8 Fiber MTP Multimode 50/125m 3mm Round Cable Plenum, High Bandwidth (OM3), 65.0m
10-88-3141
53Kb / 2P
2.54mm Pitch C-Grid® Breakaway Header, High Profile, Dual Row, Right Angle, 14
15-80-1501
40Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-47-7656
35Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature,
15-80-0541
40Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, Tin (Sn) Plating
15-47-7660
35Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature,
15-80-0645
51Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0229
40Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
30968-1208
41Kb / 1P
2.54mm Pitch, 0.64mm Width H-DAC 64 High Density Automotive Connectors
30968-1168
41Kb / 1P
2.54mm Pitch, 0.64mm Width HDAC 64 High Density Automotive Crimp Housing,
15-80-0663
40Kb / 2P
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
30700-1100
48Kb / 1P
2.54mm Pitch, 0.64mm Width H-DAC 64 High Density Automotive Connectors

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