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METAL Datasheet, PDF

P-tec Corporation(40)Panasonic Battery Group(21)Panasonic Semiconductor(106)PANDUIT CORP.(7)Pasternack Enterprises, Inc.(66)PETERMANN-TECHNIK(1)PHOENIX CONTACT(66)PIC GmbH(1)Pomona Electronics(2)PowerDynamics, Inc(25)PREMO CORPORATION S.L(3)QUARTZCOM the communications company(7)RCD COMPONENTS INC.(8)Recom International Power(1)Rectron Semiconductor(1)RFE international(29)RHOPOINT COMPONENTS(1)Riedon Powertron(26)Rohm(7)Roithner LaserTechnik GmbH(1)Rosenberger Hochfrequenztechnik GmbH & Co. KG(1)Ruilongyuan Electronics Co.,Ltd(12)SAB North America(3)Samsung semiconductor(1)Sangdest Microelectronic (Nanjing) Co., Ltd(2)Sanken electric(5)Sanyo Semicon Device(1)Schneider Electric(796)Schurter Inc.(40)Sciosense B.V.(1)Seme LAB(563)Shanghai Consonance Electronics Incorporated(1)Shanghai Cyanlite Technology Co., Ltd.(2)Shanghai Leiditech Electronic Technology Co., Ltd(15)Shanghai Yint Electronic Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(2)SHIKUES Electronics(1)Siemens Semiconductor Group(21)Sirectifier Global Corp.(2)Soshin electric Co., Ltd.(3)SparkFun Electronics(13)Stackpole Electronics, Inc.(19)Standex Electronics, Inc.(5)STMicroelectronics(3)Sumida Corporation(5)SUNMATE electronic Co., LTD(18)SUNNY Computer Technology Europe, s.r.o.(6)Suntsu Electronics, Inc.(25)Superworld Electronics(2)Suzhou HangJing Electronic Technology Co., LTD(5)Suzhou Maswell Communication Technology Co. Ltd(2)TAI-SAW TECHNOLOGY CO., LTD.(1)TAITRON Components Incorporated(2)Taiwan Semiconductor Company, Ltd(1)Taiyo Yuden (U.S.A.), Inc(738)Taoglas antenna solutions(2)TDK Electronics(37)TE Connectivity Ltd(14)TEMEX(2)Tensility International Corp.(3)Texas Instruments(3)Texas Instruments(2)Thinki Semiconductor Co., Ltd.(4)Token Electronics Industry Co., Ltd.(9)TOKO, Inc(70)TOKYO SEIMITSU CO., LTD(4)Total Power International(3)Tripp Lite. All Rights Reserved(22)TT Electronics.(15)Tumbler Technologies + TRUMPower(1)Tyco Electronics(43)
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Searched Keyword : 'Metal' - Total: 21 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Siemens Semiconductor G... 		KTY16-6 Datasheet pdf image
20Kb/2P		 Silicon Spreading Resistance Temperature Sensor in Miniature Metal Housing
KTY19- Datasheet pdf image
56Kb/2P		 Silicon Spreading Resistance Temperature Sensor in Robust Threaded Metal Housing
3SB3501-2UA71 Datasheet pdf image
218Kb/3P		 22MM METAL ROUND ACTUATOR: SELECTOR SWITCH HEAVY DUTY LEFT LATCH.
3SB3500-0AA21 Datasheet pdf image
133Kb/3P		 22MM METAL ROUND ACTUATOR: PUSHBUTTON WITH FLAT BUTTON WITH HOLDER RED
BSM200GAL120DN2 Datasheet pdf image
76Kb/5P		 IGBT Power Module (Single switch with chopper diode Package with insulated metal base plate)
BSM150GB120DN2 Datasheet pdf image
131Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM150GB170DN2 Datasheet pdf image
131Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM25GB120DN2 Datasheet pdf image
111Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM100GB170DN2 Datasheet pdf image
130Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM75GB170DN2 Datasheet pdf image
113Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM200GB120DN2 Datasheet pdf image
130Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM100GB120DN2 Datasheet pdf image
132Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM400GB60DN2 Datasheet pdf image
127Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM100GB120DN2K Datasheet pdf image
114Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM50GB120DN2 Datasheet pdf image
112Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM75GB120DN2 Datasheet pdf image
112Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM50GB170DN2 Datasheet pdf image
112Kb/9P		 IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
BSM100GT120DN2 Datasheet pdf image
180Kb/9P		 IGBT Power Module (Three single switches Including fast free-wheeling diodes Package with insulated metal base plate)
BSM50GAL120DN2 Datasheet pdf image
62Kb/5P		 IGBT Power Module (Single switch with chopper diode Including fast free-wheeling diodes Package with insulated metal base plate)
BSM25GAL120DN2 Datasheet pdf image
62Kb/5P		 IGBT Power Module (Single switch with chopper diode Including fast free-wheeling diodes Package with insulated metal base plate)

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What is Metal

In electronic components, the term METAL generally refers to a metal material with high electrical conductivity.

Various types of metal materials are used in electronic components.

For example, metals are used in materials such as contacts, leads, wires, and circuit boards (PCBs) used in electronic components.

This is essential for the efficient transmission of electricity and for maintaining the reliability and performance of electronic components.

In addition, various parts based on metal materials are also used in electronic components.

For example, the electrodes of capacitors, inductor cores, transformer cores, etc.

These parts are essential for electronic components to function.

Among metal materials, the most commonly used metals are copper, aluminum, iron, nickel, gold, and silver.

These metals are widely used in the manufacture of electronic components because of their excellent electrical conductivity, processability and durability.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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