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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 41 (1/3) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Shindengen Electric Mfg...
S10WB60 Datasheet pdf image
432Kb/4P
Square In-line Package (Input/Output In-line Package)
S20WB60 Datasheet pdf image
465Kb/4P
Square In-line Package (Input/Output In-line Package)
S15WB60 Datasheet pdf image
431Kb/4P
Square In-line Package (Input/Output In-line Package)
D3SB60 Datasheet pdf image
444Kb/4P
Single In-line Package
D4SBL20U Datasheet pdf image
615Kb/4P
Single In-line Package
D15XBN20 Datasheet pdf image
573Kb/4P
Single In-line Package
S2VB60 Datasheet pdf image
364Kb/4P
Square In-line Package
S10VB60 Datasheet pdf image
412Kb/4P
Square In-line Package
UD2KB80 Datasheet pdf image
828Kb/4P
Single In-line Package
UD3KB80 Datasheet pdf image
821Kb/4P
Single In-line Package
D2SBA60 Datasheet pdf image
557Kb/4P
Single In-line Package
D5SB60 Datasheet pdf image
440Kb/4P
Single In-line Package
D20XB60 Datasheet pdf image
433Kb/4P
Single In-line Package
D30XBN20 Datasheet pdf image
574Kb/4P
Single In-line Package
D4SBN20 Datasheet pdf image
575Kb/4P
Single In-line Package
D5SBA60 Datasheet pdf image
436Kb/4P
Single In-line Package
S4VB60 Datasheet pdf image
392Kb/4P
Square In-line Package
S25VB60 Datasheet pdf image
396Kb/4P
Square In-line Package
D4SBS4 Datasheet pdf image
639Kb/4P
Single In-line Package
D30VC60 Datasheet pdf image
399Kb/4P
Square In-line Package

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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