PACKAGE Datasheet(PDF) - SC70-6 - Zetex Semiconductors

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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 40 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Zetex Semiconductors	SC70-6	174Kb/3P	Package information
	SC70-5	195Kb/3P	Surface mounted, 5 pin package Package outline
	SOD523	177Kb/3P	Surface mounted, 2 pin package Package outline
	MLP322	176Kb/3P	Surface mounted, 3 pin package Package outline
	TO92	87Kb/2P	Through hole, 3 pin package Package outline
	MLP832	185Kb/3P	Package information - MLP832
	SOD323	189Kb/3P	Surface mounted, 2 pin package
	SOT23	167Kb/3P	Surface mounted, 3 pin package
	TSOT23-5	165Kb/3P	Surface mounted, 5 pin package
	SOT23F	163Kb/3P	Surface mounted, 3 pin package
	SOT323	168Kb/3P	Surface mounted, 3 pin package
	SOT23-5	206Kb/3P	Surface mounted, 5 pin package
	TSSOP20	122Kb/3P	Surface mounted, 20 pin package
	SSOP28	174Kb/3P	Surface mounted, 28 pin package
	ZXSDS2M832	202Kb/6P	MPPS Miniature Package Power Solutions
	DIL14	48Kb/2P	Dual in-line, 14 pin package
	DIL8	48Kb/2P	Dual in-line, 8 pin package
	ZXMC3AM832	280Kb/10P	MPPS??Miniature Package Power Solutions COMPLEMENTARY 30V ENHANCEMENT MODE MOSFET
	ZXTAM322	180Kb/6P	MPPS Miniature Package Power Solutions 15V NPN LOW SATURATION TRANSISTOR
	ZXTCM322	185Kb/6P	MPPS??Miniature Package Power Solutions 50V NPN LOW SATURATION TRANSISTOR

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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