PACKAGE Datasheet(PDF) - AL-HKB33_09 - A-BRIGHT Inc

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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 45 (1/3) Pages

Manufacturer	Part #	Datasheet	Description
A-BRIGHT Inc	AL-HKB33	207Kb/5P	1206 Package Yellow SMD Chip LED Lamps
	AL-HW435A	206Kb/5P	0805 Package White SMD Chip LED Lamps
	AL-HKB35A	207Kb/5P	0805 Package Yellow SMD Chip LED Lamps
	AL-HUB35A	207Kb/5P	0805 Package Red SMD Chip LED Lamps
	AL-HUB33	218Kb/5P	1206 Package Red SMD Chip LED Lamps
	AL-HB435A	207Kb/5P	0805 Package Blue SMD Chip LED Lamps
	AL-HG633A	341Kb/5P	1206 Package Green SMD Chip LED Lamps 2006/10/11
	AL-HB433	207Kb/5P	1206 Package Blue SMD Chip LED Lamps
	62-217BUW1C1	625Kb/8P	5630 Package Power White Surface Mount Device
	62-217BUW1C2	646Kb/8P	5630 Package Power White Surface Mount Device
	AL-HG633	339Kb/5P	1206 Package Green SMD Chip LED Lamps 2006/10/11
	AL-HW433	207Kb/5P	1206 Package White SMD Chip LED Lamps
	62-217BSW1C2	657Kb/8P	5630 Package Power Warm White Surface Mount Device
	62-217BUW1C1	636Kb/8P	5630 Package Power Warm White Surface Mount Device
	AL-HG433	340Kb/5P	1206 Package Bluish Green SMD Chip LED Lamps 2006/10/11
	62-217BSW1C2	646Kb/8P	5630 Package Power Warm White Surface Mount Device
	AL-HGD35A	207Kb/5P	0805 Package Yellow Green SMD Chip LED Lamps 2009/02/19
	62-217BSW1C1	625Kb/8P	5630 Package Power Warm White Surface Mount Device
	AL-HG635A	207Kb/5P	0805 Package Pure Green SMD Chip LED Lamps
	AL-HB433	340Kb/5P	1206 Package Super Blue SMD Chip LED Lamps 2006/10/11

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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