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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 11 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Fujitsu Component Limit...
FPT-8P-M01 Datasheet pdf image
23Kb/1P
SMALL OUTLINE L-LEADED PACKAGE
FPT-20P-M04 Datasheet pdf image
37Kb/1P
THIN SHRINK SMALL OUTLINE PACKAGE
BGA-320P-M06 Datasheet pdf image
34Kb/1P
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
FPT-28P-M17 Datasheet pdf image
36Kb/1P
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC
FPT-208P-M06 Datasheet pdf image
57Kb/1P
LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC
FPT-8P-M02 Datasheet pdf image
23Kb/1P
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
FPT-64P-M09 Datasheet pdf image
58Kb/1P
LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC
MB84VD23381FJ Datasheet pdf image
827Kb/54P
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
MB15F74UV Datasheet pdf image
151Kb/17P
ASSP Dual Serial Input PLL Frequency Synthesizer(Small Package)
MB15F76UV Datasheet pdf image
151Kb/17P
ASSP Dual Serial Input PLL Frequency Synthesizer(Small Package)
DIMENSION_F5CP_F6CP Datasheet pdf image
59Kb/2P
2.5 x 2.0mm package F5CP / F6CP Dimensions & Pin Configuration

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What is PACKAGE


In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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