PACKAGE Datasheet(PDF) - LTC4210-1_15 - Linear Technology

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PACKAGE Datasheet, PDF

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Searched Keyword : 'PACKAGE' - Total: 34 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Linear Technology	LTC4210-1	256Kb/20P	Hot Swap Controller in 6-Lead SOT-23 Package
	LTC5509	188Kb/8P	300MHz to 3GHz RF Power Detector in SC70 Package
	LTC4210-3	230Kb/16P	Hot Swap Controller in 6-Lead SOT-23 Package
	LTC4210-3	224Kb/16P	Hot Swap Controller in 6-Lead SOT-23 Package
	LTC4210-2	256Kb/20P	Hot Swap Controller in 6-Lead SOT-23 Package
	LTC4210-1CS6	246Kb/20P	Hot Swap Controller in 6-Lead SOT-23 Package
	LTC4210-4	230Kb/16P	Hot Swap Controller in 6-Lead SOT-23 Package
	LT6300	239Kb/16P	500mA, 200MHz xDSL Line Driver in 16-Lead SSOP Package
	LTC1659	136Kb/12P	12-Bit Rail-to-Rail Micropower DAC in MSOP Package
	LTC1659	132Kb/12P	12-Bit Rail-to-Rail Micropower DAC in MSOP Package
	LTC1659	142Kb/12P	12-Bit Rail-to-Rail Micropower DAC in MSOP Package
	LTC5509	177Kb/8P	300MHz to 3GHz 300MHz RF Power Detector in SC70 Package
	LTC1655L	184Kb/16P	16-Bit Rail-to-Rail Micropower DACs in SO-8 Package
	LTC1655	184Kb/16P	16-Bit Rail-to-Rail Micropower DACs in SO-8 Package
	LTC1655	92Kb/12P	16-Bit Rail-to-Rail Micropower DAC in SO-8 Package
	LT6300	232Kb/16P	500mA, 200MHz X DSL LINE DRIVER IN 16-LEAD SSOP PACKAGE
	LT1178S8	120Kb/2P	20uA Max, Dual SO-8 Package, Single Supply Precision Op Amp
	LT6301	252Kb/16P	Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package
	LT3466-1	415Kb/20P	White LED Driver and Boost Converter in 3mm 3mm DFN Package
	LT6301	225Kb/16P	Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package

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What is PACKAGE

In electronic parts, PACKAGE means a case or package used to protect and connect devices.

PACKAGE plays an important role in protecting and connecting devices.

If the device is not properly protected, environmental influences can damage or destroy the device.

PACKAGE comes in various shapes and sizes, and there are various types depending on the type and purpose of the device.

Representative packages include DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), and BGA (Ball grid array).

A DIP is one of the more representative packages and has two pins placed in-line.

SOPs are smaller packages than DIPs and have a rectangular shape.

QFP is a package with pins parallel to the circumference of the package, and BGA is a package in which small holes are drilled in the bottom of the elements and small beads are attached to them to connect the elements.

Depending on the characteristics of each package, it is used for various purposes.

For example, DIPs are generally used for low-density integrated circuits, and BGAs are used for high-density integrated circuits.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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