Manufacturer | Part # | Datasheet | Description |
Sangdest Microelectroni...
|
ST3060DJF |
131Kb/4P |
Low thermal resistance |
87CNQ020 |
227Kb/5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
183NQ-1 |
184Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
201CNQ |
209Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
300CNQ |
213Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
303DMQ600 |
174Kb/3P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
40CPQ015 |
129Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
MBRB10200CT |
262Kb/7P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
63CPQ080 |
141Kb/5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
400CMQ |
210Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
MBR2535 |
204Kb/6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
301CNQ |
206Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
303CNQ |
211Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
MBR2035 |
170Kb/6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |